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Advanced Packaging Process Engineer, Silicon Technology (Starlink)
Исключительная возможность работать в SpaceX над проектом Starlink. Высокий престиж компании и работа с передовыми технологиями перевешивают требования к интенсивности труда.
Сложность вакансии
Высокая сложность обусловлена необходимостью глубоких знаний в микроэлектронике, строгими требованиями ITAR (гражданство/ВНЖ США) и культурой SpaceX, предполагающей работу в сжатые сроки.
Анализ зарплаты
Зарплата в SpaceX для инженеров такого уровня в Техасе обычно находится в диапазоне $110,000–$160,000 плюс значительный пакет акций, что соответствует или слегка превышает рыночные показатели для полупроводниковой отрасли в данном регионе.
Сопроводительное письмо
I am writing to express my strong interest in the Advanced Packaging Process Engineer position within the Starlink team at SpaceX. With a solid foundation in semiconductor packaging and hands-on experience in process development, I am eager to contribute to SpaceX's mission of vertical integration by bringing advanced silicon assembly in-house. My background aligns perfectly with your need for an engineer who can own packaging products from concept through to mass production.
Throughout my career and academic projects, I have developed a deep understanding of wafer-level and chip-level systems, including critical processes such as flip chip bonding, molding, and underfill. I am particularly drawn to this role because of the opportunity to work on next-generation panel-level packaging and to interface cross-functionally with silicon design and materials teams. I am a hands-on problem solver who thrives in dynamic environments and is committed to meeting the rigorous quality and reliability standards required for aerospace and global telecommunications.
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Откликнитесь в spacex уже сейчас
Присоединяйтесь к SpaceX и создавайте будущее спутниковой связи, внедряя передовые технологии упаковки чипов для Starlink!
Описание вакансии
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
ADVANCED PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)
SpaceX is leveraging its experience building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation, providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact. As we continue to upgrade and expand the constellation, we’re looking for best-in-class engineers to join the team.
In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing advanced silicon packaging and assembly in-house for development and manufacturing. We are looking for hands-on, dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and testing. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.
RESPONSIBILITIES:
- Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems
- Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes
- Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
- Own packaging prototypes, product development, and release to production
- Select equipment and material to meet quality, reliability, cost, yield, and production targets
- Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
- Cross-functional interface with silicon design, materials, thermal, systems, and production teams
- Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond
BASIC QUALIFICATIONS:
- Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline
- 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)
PREFERRED SKILLS AND EXPERIENCE:
- Advanced technical degree
- 3+ years industry experience with microelectronics packaging development
- Hands-on packaging, PCB, PCBA, or SMT assembly experience
- OSAT (outsource semiconductor assembly and test) experience
ADDITIONAL REQUIREMENTS:
- Ability to work extended hours or weekends as needed for mission critical deadlines
ITAR REQUIREMENTS:
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.
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Навыки
- Semiconductor Packaging
- Wafer Dicing
- Lithography
- Flip Chip
- SMT
- PCB Design
- Etching
- Sputtering
- NPI
- Materials Science
- Microelectronics
Возможные вопросы на собеседовании
Проверка практического опыта в ключевых процессах, упомянутых в вакансии.
Опишите ваш опыт работы с процессами flip-chip и wafer-level packaging. С какими основными дефектами вы сталкивались и как их устраняли?
Важно понять, как кандидат выбирает оборудование для новых линий NPI.
Какими критериями вы руководствуетесь при выборе поставщиков оборудования и материалов для массового производства полупроводников?
Роль предполагает владение продуктом от идеи до выпуска.
Расскажите о случае, когда вам пришлось переносить процесс из лаборатории в массовое производство. Какие возникли сложности с масштабированием?
SpaceX ценит междисциплинарный подход.
Как вы взаимодействуете с командами по дизайну кристаллов и теплотехниками для оптимизации надежности упаковки?
Проверка стрессоустойчивости и готовности к переработкам.
Как вы расставляете приоритеты в условиях жестких дедлайнов, когда возникают критические сбои на линии сборки?
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