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Senior Optical Packaging & Assembly Engineer
Исключительная возможность работать в одной из самых перспективных компаний в сфере квантовых вычислений. Работа в современном R&D центре в Великобритании над технологиями, которые определят будущее индустрии.
Сложность вакансии
Высокая сложность обусловлена узкой специализацией в области фотонных интегральных схем (PIC) и требованием глубоких знаний в прецизионной сборке оптических компонентов. Необходим опыт работы с FAU и сложным анализом оптических данных.
Анализ зарплаты
Предлагаемая позиция Senior Engineer в области фотоники в Великобритании обычно оплачивается выше среднего по рынку из-за дефицита специалистов. Указанный диапазон соответствует уровню компенсации в высокотехнологичных R&D центрах и стартапах уровня Series D+.
Сопроводительное письмо
I am writing to express my strong interest in the Senior Optical Packaging & Assembly Engineer position at PsiQuantum. With over five years of experience in optical measurements and a specialized focus on Photonic Integrated Circuit (PIC) packaging, I have developed a deep understanding of the technical challenges involved in high-accuracy fiber-to-chip alignment. My background in developing scalable assembly workflows aligns perfectly with PsiQuantum’s mission to build fault-tolerant quantum systems using silicon photonics.
In my previous roles, I have successfully managed the transition from prototyping to high-volume packaging processes, working closely with external vendors and supply chain partners. I am particularly drawn to PsiQuantum’s approach of leveraging standard semiconductor manufacturing to scale quantum computing. I am confident that my expertise in FAU-to-chip attachment and optical data analysis will contribute significantly to the development of robust opto-electronic packaging solutions at your Daresbury R&D facility.
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Откликнитесь в psiquantum уже сейчас
Присоединяйтесь к созданию первого в мире полезного квантового компьютера в PsiQuantum!
Описание вакансии
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems.
Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries.
Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure.
In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale.
PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact.
Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real.
Come join us.
Job Summary:
The Senior Optical Packaging Engineer is responsible for developing & implementing high-performance, robust & scalable opto-electronic packaging workflows for a variety of chip-based photonic integrated circuits. This work will be carried out in PsiQuantum’s UK R&D facility located in Daresbury Lab.
Responsibilities:
- Develop an optical package and fibre-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
- Help develop packaging prototypes & scalable fibre-to-chip packaging flows and processes.
- Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
- Work with our internal packaging team and external vendors on transferring & scaling packaging designs and processes based on successful prototypes.
- Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
- Working with external partners to develop advanced opto-electronic packaging solutions.
Experience/Qualifications:
- Master’s Degree or above in Optical Engineering, Physics or equivalent.
- 3+ years of experience working on PIC packaging design & qualification.
- 5+ years of experience working with optical fibers, optical measurements.
- 3+ years of experience working on FAU / optical connector to chip attachment.
- Experience with optical data analysis.
PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.
Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.
We are not accepting unsolicited resumes from employment agencies.
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Навыки
- Optical Engineering
- Physics
- Photonic Integrated Circuits
- Optical Fiber
- Optical Measurement Techniques
- Data Analysis
- Supply Chain Management
- Prototyping
- Semiconductors
- Silicon Photonics
Возможные вопросы на собеседовании
Проверка практического опыта в ключевой задаче роли — обеспечении точности при масштабировании.
Расскажите о вашем опыте разработки схем выравнивания волокна с чипом (fiber-to-chip alignment). С какими основными трудностями вы сталкивались при переходе от прототипа к масштабируемому производству?
Важно понять, как кандидат взаимодействует с поставщиками для обеспечения качества компонентов.
Как вы подходите к выбору внешних поставщиков для критически важных компонентов упаковки (BOM) и какие метрики качества вы используете для их оценки?
Роль требует навыков обработки данных для оптимизации процессов.
Какие инструменты и методы вы используете для анализа оптических данных при квалификации упаковки PIC?
Проверка технических знаний в специфической области крепления коннекторов.
Опишите ваш опыт работы с Fiber Array Units (FAU). Какие методы крепления к чипу вы считаете наиболее надежными для долгосрочной эксплуатации?
Оценка способности работать в междисциплинарной среде квантовых вычислений.
Как вы адаптируете процессы упаковки для работы в условиях криогенных температур, учитывая специфику фотонных квантовых систем?
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