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Lead Electronics Engineer, Gateways (Starlink)
Это исключительная возможность работать в одной из самых инновационных компаний мира над проектом глобального масштаба. Высокая видимость роли, работа с передовыми технологиями и участие в миссии SpaceX делают эту вакансию максимально привлекательной для топ-инженеров.
Сложность вакансии
Высокая сложность обусловлена ролью лида, строгими требованиями ITAR и необходимостью глубоких знаний в смежных областях: от высокоскоростных интерфейсов до оптических сетей. Работа в SpaceX предполагает высокий темп и ответственность за критически важное оборудование.
Анализ зарплаты
Зарплата в SpaceX для позиций уровня Lead в Техасе обычно находится в верхнем диапазоне рынка, дополняясь значительным пакетом акций (RSU), что делает совокупный доход выше среднего по региону.
Сопроводительное письмо
I am writing to express my strong interest in the Lead Electronics Engineer position for the Starlink Gateway team. With a deep background in designing high-reliability mixed-signal circuit boards and managing complex hardware lifecycles, I am eager to contribute to SpaceX's mission of providing global internet connectivity. My experience in driving electrical architecture from concept to production aligns perfectly with your goal of developing next-generation ground station hardware.
Throughout my career, I have successfully led engineering teams to deliver robust solutions involving high-speed Serdes, DDR4 interfaces, and complex networking protocols. I thrive in cross-functional environments where electrical, mechanical, and software engineering intersect. I am particularly drawn to SpaceX's philosophy of in-house production and rapid iteration, and I am confident that my technical expertise and leadership skills will help accelerate the development of Starlink’s gateway systems.
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Откликнитесь в spacex уже сейчас
Присоединяйтесь к SpaceX, чтобы возглавить разработку электроники для глобальной сети Starlink и помочь человечеству стать мультипланетарным видом!
Описание вакансии
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
LEAD ELECTRONICS ENGINEER, GATEWAYS (STARLINK)
Starlink believes in providing fast, reliable internet to serve populations with little or no connectivity. We design, build, launch, and operate the world's largest constellation of satellites, enabling us to operate a global internet network unbounded by traditional ground infrastructure limitations. Starlink also designs, builds, and delivers high-volume consumer hardware that allows users to connect to these satellites within minutes of unboxing, as well as our advanced gateways that we deploy regionally throughout the world. The root of SpaceX’s success so far lies in our mission to keep all engineering and production in-house, which enables a tight feedback loop, nimble decision-making, and speedy deliverables. With millions of daily users worldwide already online, Starlink is truly a game changer and levels the playing field for those who were previously unconnected.
As the Lead Electronics Engineer on the Starlink team, you will be responsible for the design, performance, and reliability of next-generation gateways - ultimately ensuring that our ground station antenna hardware can withstand the harshest environmental conditions while maintaining reliable communication with millions of users on a global scale. This is a high-visibility role in which you own the entire life cycle of hardware that sits at the intersection of electrical, mechanical, thermal, software, and antenna/RF engineering.
RESPONSIBILITIES:
- Lead a team of 3-5 engineers to rapidly design, develop, and test highly reliable electronics for our Gateway systems
- Drive electrical architecture, specification, component selection, circuit board design, implementation, verification, board bring-up, and debugging
- Optimize existing designs to improve reliability and reduce production and field defects
- Implement automated design validation test assets to speed up development cycles
- Develop and train direct reports to enable product ownership and empowered decision making
- Partner with antenna, software, mechanical, networking, thermal, manufacturing and production test teams
BASIC QUALIFICATIONS:
- Bachelor’s degree in electrical engineering, computer engineering or physics
- 3+ years of professional experience with hardware design/development or electronics test engineering
PREFERRED SKILLS AND EXPERIENCE:
- 6+ years of professional experience rapidly designing and delivering highly-reliable products
- 6+ years of electronic product experience designing hardware from concept through production; strong emphasis on full life cycle development of new hardware products and not small incremental updates to legacy hardware
- 6+ years of experience designing and implementing mixed-signal circuit boards from concept through production using processors, FPGAs, Ethernet, multi-GHz Serdes, DRAM interfaces (DDR4), I2C, SPI, operational amplifiers, analog to digital and digital to analog converters, and power supply components
- 6+ years of professional experience testing, troubleshooting, and debugging electronics
- Strong understanding of computer networking and interfaces (10/100/400/800G networking/Tbps switches)
- Strong understanding of optical networking architectures and fundamentals
- Strong understanding of computers and programming languages (Python, C/C++)
- Experience in desktop/server Linux and embedded operating systems
- Demonstrated ability to work in a highly cross-functional role
- Excellent communication skills both written and verbal
ADDITIONAL REQUIREMENTS:
- Ability to work extended hours or weekends as needed for mission critical deadlines
- Ability to travel to other sites (Hawthorne, CA and Redmond, WA) up to 20%
ITAR REQUIREMENTS:
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.
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Навыки
- PCB Design
- Mixed-signal Electronics
- FPGA
- Ethernet
- DDR4
- SerDes
- I2C
- SPI
- Python
- C++
- Linux
- Embedded Systems
- Hardware Architecture
- Debugging
Возможные вопросы на собеседовании
Проверка лидерских качеств и умения развивать команду в условиях жестких дедлайнов.
Расскажите о случае, когда вам пришлось принимать сложное архитектурное решение под давлением сроков. Как вы мотивировали команду?
Оценка технических знаний в области высокоскоростной передачи данных, критичной для шлюзов Starlink.
С какими основными проблемами целостности сигналов вы сталкивались при проектировании интерфейсов multi-GHz Serdes или DDR4?
Проверка понимания полного жизненного цикла продукта и надежности.
Как вы подходите к проектированию электроники, которая должна работать в экстремальных условиях окружающей среды в течение многих лет?
Оценка навыков отладки сложных систем.
Опишите ваш процесс поиска и устранения трудновоспроизводимой ошибки в смешанной (mixed-signal) системе на этапе запуска платы (board bring-up).
Проверка способности работать на стыке разных дисциплин.
Как вы взаимодействуете с инженерами-механиками и теплотехниками при оптимизации компоновки печатной платы для высокомощных систем?
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