Vice President of Operations (Semiconductor)

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About Ethernovia, Inc.

Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications. 

Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured $154M ($90+M Series-B and $64M Series-A) in total funding to date:

• Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips
• Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire

+ (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital)

Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025.

• March 2026: Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms
• January 2024: Our CEO Ramin Shirani Named MotorTrend Software-Defined Vehicle Innovator Awards Winner (ethernovia.com)
• September 2023: [Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
 - Ethernovia](https://www.ethernovia.com/blog/continental-and-ethernovia-announce-partnership/)
• Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news

With talented employees on 4 continents, we have filed 50+ patents to date.

Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility.

Vice President of Operations (Semiconductor)

Summary:

• The VP of Operations will be the architect of Ethernovia’s delivery engine. Unlike purely administrative operations roles, this position requires a leader who is hands-on with semiconductor product, test, and qualification. You will bridge the gap between world-class networking chip designs and high-volume, automotive-grade silicon manufacturing.

Key Responsibilities:

• Hands-on Product & Test Leadership: Drive the development of test hardware and software (wafer sort and final test). Oversee characterization, bench-to-ATE correlation, and limit-setting to ensure high-performance networking specs are met.
• End-to-End Semiconductor Qualification: Take direct ownership of the qualification strategy. You must have hands-on experience defining and executing stress testing, including HTOL (High-Temperature Operating Life), ESD, Latch-up, and HAST to ensure long-term silicon reliability.
• Automotive Grade Execution: Lead the transition to Automotive Qualification, ensuring all products meet rigorous reliability standards (AEC-Q100) and functional safety requirements (ISO 26262).
• Networking Silicon Manufacturing: Direct the operational lifecycle for high-speed Ethernet packet processors and PHYs, ensuring signal integrity and performance standards are maintained at scale.
• Foundry & OSAT Management: Act as the primary technical and commercial interface with Tier-1 foundries and OSAT partners; manage wafer capacity, production scheduling, and technology nodes.
• Yield & Cost Optimization: Use data-driven product engineering techniques to drive aggressive yield improvements and COGS reductions.

Required Experience & Skills:

Professional Background

• Semiconductor Operations Mastery: 15+ years of experience in fabless semiconductor operations, specifically for complex, high-performance SOCs or networking ICs.
• Hands-on Qualification Expertise: Must have direct experience managing and executing semiconductor qualification flows. You should be comfortable reviewing raw reliability data and troubleshooting failure mechanisms (FA).
• Product/Test Engineering: Proven track record of direct involvement in ATE (Automated Test Equipment) strategy, test time reduction, and product binning for high-speed communications chips.
• Automotive Tech & Quality: Experience navigating the Automotive electronics ecosystem, including IATF 16949, ISO 26262, and PPAP (Production Part Approval Process).
• Series B to Scale: Proven track record of building an operations and supply chain function from the ground up in a venture-backed startup.
• Education: Bachelor’s or Master’s degree in Electrical Engineering or a related technical field.

Technical Leadership & Skills:

• Vendor Management: Expert-level negotiation skills with Tier-1 partners (Foundries, Assembly, and Test houses).
• Networking Communications Focus: Understanding of the operational requirements for high-bandwidth data-path products (Ethernet, Switching, or high-speed SerDes).
• Systems Implementation: Experience deploying ERP systems (e.g., NetSuite, SAP) tailored for semiconductor supply chain and inventory tracking.

Nice to Have (The "Competitive Advantage"):

• TSMC Experience: Direct experience managing manufacturing flows through TSMC, including familiarity with their latest process nodes, FinFET technologies, and capacity planning.
• IPO & Public Company Readiness: Experience scaling operations for a company that successfully navigated an Initial Public Offering (IPO).
• International Expansion: Experience establishing operational hubs or quality centers in Europe or Asia to support global Tier-1 automotive OEMs.

Personal Skills:

• Excellent communication/documentation skills.
• Attention to details.
• Collaboration across multidisciplinary and international teams.

What You Can Expect From Ethernovia:

• Technology depth and breadth expansion that can’t be found in a large company
• Opportunity to grow your career as the company grows
• Pre IPO stock options
• Cutting edge technology
• World class team
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance for employees

Salary Range:

• The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $220,000 - $300,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, as well as eligibility for performance bonuses, in addition to base salary and a full range of medical and other benefits.

\* Principals Only (No Agencies)

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